The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2019
Filed:
Nov. 30, 2018
Mitsubishi Electric Corporation, Tokyo, JP;
Nippon Tanshi Co., Ltd., Kanagawa, JP;
Fumiaki Arimai, Tokyo, JP;
Hiroyoshi Nishizaki, Tokyo, JP;
Shinya Enomoto, Kanagawa, JP;
Osamu Nishimura, Kanagawa, JP;
Masaru Fujino, Kanagawa, JP;
Mitsubishi Electric Corporation, Chiyoda-ku, Tokyo, JP;
NIPPON TANSHI CO., LTD., Hiratsuka-shi, Kanagawa, JP;
Abstract
An electronic device unit includes a circuit board having: a sealing resin portion in which a region in which an electronic component is mounted is sealed by a sealing resin; and a board end portion exposed from a side of the sealing resin portion. A plurality of connection terminals are provided on the board end portion so as to be aligned in a direction of the side of the sealing resin portion, and a resin portion thicker than the board end portion and having a wall-like projection shape is provided at at least one of side surfaces of the board end portion in the direction of the side. The resin portion is integrally molded with the sealing resin portion of the circuit board and a side surface of the resin portion is press-fitted into an insertion chamber of a connector.