The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2019

Filed:

Dec. 21, 2018
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Ryuken Mizunuma, Kyoto, JP;

Kaoru Sudo, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 1/38 (2006.01); H01Q 1/52 (2006.01); H01L 23/66 (2006.01); H01Q 19/24 (2006.01); H01Q 21/06 (2006.01); H01Q 13/08 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/526 (2013.01); H01L 23/66 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/38 (2013.01); H01Q 13/08 (2013.01); H01Q 21/062 (2013.01); H01Q 21/065 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15321 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19105 (2013.01); H01Q 19/24 (2013.01);
Abstract

A ground layer is disposed within a dielectric substrate. An antenna pattern that operates as an antenna is disposed so as to be closer to a first surface of the dielectric substrate than the ground layer is. A high-frequency device that supplies a high-frequency signal to the antenna pattern is mounted in or on a second surface of the dielectric substrate, which is opposite to the first surface. A plurality of signal conductor columns and a plurality of ground conductor columns that are made of a conductive material project from the second surface. Each of the signal conductor columns is connected to the high-frequency device by a wiring pattern, which is provided in or on the dielectric substrate, and the ground conductor columns are connected to the ground layer.


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