The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2019

Filed:

Jan. 19, 2015
Applicant:

Gapwaves Ab, Göteborg, SE;

Inventors:

Farid Hadavy, Göteborg, SE;

Per-Simon Kildal;

Assignee:

Gapwaves AB, Göeborg, SE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 3/123 (2006.01); H01Q 21/00 (2006.01); B21K 23/00 (2006.01); H01P 1/211 (2006.01); H01Q 1/38 (2006.01); H01Q 21/06 (2006.01); H01P 1/20 (2006.01); H01Q 13/02 (2006.01); H01Q 13/10 (2006.01); H01Q 21/20 (2006.01);
U.S. Cl.
CPC ...
H01P 3/123 (2013.01); B21K 23/00 (2013.01); H01P 1/211 (2013.01); H01Q 1/38 (2013.01); H01Q 21/005 (2013.01); H01Q 21/0087 (2013.01); H01Q 21/064 (2013.01); H01P 1/2005 (2013.01); H01Q 13/0283 (2013.01); H01Q 13/10 (2013.01); H01Q 13/106 (2013.01); H01Q 21/0037 (2013.01); H01Q 21/20 (2013.01);
Abstract

A method and apparatus for producing an RF part of an antenna system is disclosed, as well as thereby producible RF parts. The RF part has at least one surface provided with a plurality of protruding elements. In particular, the RF part may be a gap waveguide. The protruding elements are monolithically formed and fixed on a conducting layer, and all protruding elements are connected electrically to each other at their bases via the conductive layer. The RF part is produced by providing a die having a plurality of recessions forming the negative of the protruding elements of the RF part. The die may be a multilayer die, having several layers, at least some having through-holes to form the recessions. A formable piece of material is arranged on the die, and pressure is applied, thereby compressing the formable piece of material to conform with the recessions of the die.


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