The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2019

Filed:

Nov. 22, 2016
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Heather Debra Boek, Corning, NY (US);

Theresa Chang, Painted Post, NY (US);

Leonard Charles Dabich, II, Painted Post, NY (US);

Mark Alan Lewis, Horseheads, NY (US);

Stephan Lvovich Logunov, Corning, NY (US);

Mark Alejandro Quesada, Horseheads, NY (US);

Wageesha Senaratne, Horseheads, NY (US);

Alexander Mikhailovich Streltsov, Corning, NY (US);

Assignee:

Corning Incorporated, Corning, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); H01L 51/56 (2006.01); B23K 26/24 (2014.01); C03C 8/02 (2006.01); C03C 8/24 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5246 (2013.01); B23K 26/24 (2013.01); C03C 8/02 (2013.01); C03C 8/24 (2013.01); H01L 51/56 (2013.01); C03C 2205/00 (2013.01);
Abstract

A laser weldable device housing substrate, device housing and related method are provided. The substrate includes a first surface, a second surface opposite the first surface, and a thin inorganic particle layer supported by the first surface. The inorganic particle layer includes a plurality of particles arranged in a layer on the first surface. The particles have an average diameter of less than or equal to 1.0 μm, and the inorganic particle layer has an average thickness of less than or equal to 5 μm.


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