The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2019
Filed:
Jun. 26, 2018
Applicant:
Toshiba Memory Corporation, Tokyo, JP;
Inventors:
Mikiko Mori, Kuwana, JP;
Ryota Suzuki, Yokkaichi, JP;
Tatsuya Kato, Yokkaichi, JP;
Wataru Sakamoto, Yokkaichi, JP;
Fumie Kikushima, Yokkaichi, JP;
Assignee:
TOSHIBA MEMORY CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11529 (2017.01); H01L 27/11556 (2017.01); H01L 27/11524 (2017.01);
U.S. Cl.
CPC ...
H01L 27/11556 (2013.01); H01L 27/11524 (2013.01); H01L 27/11529 (2013.01);
Abstract
A semiconductor device according to an embodiment includes two semiconductor pillars, a connection member connected between the two semiconductor pillars, and a contact connected to the connection member. There is not a conductive member disposed between the two semiconductor pillars.