The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2019

Filed:

Jan. 17, 2018
Applicant:

Shenzhen China Star Optoelectronics Technology Co., Ltd., Shenzhen, Guangdong, CN;

Inventor:

Zhiwu Wang, Guangdong, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/40 (2010.01); H01L 27/12 (2006.01); H01L 25/16 (2006.01); H01L 33/62 (2010.01); H01L 33/60 (2010.01); H01L 33/44 (2010.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 27/1248 (2013.01); H01L 33/405 (2013.01); H01L 33/44 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A Micro LED display panel and manufacturing method thereof are provided. The method of manufacturing Micro LED display panel, comprising providing a TFT substrate and opening a channel on the top of TFT substrate for exposing a source or a drain inside; preparing a planar layer on the top of the TFT substrate; opening a countersink hole on the planar layer; preparing a bottom electrode in the countersink hole and the channel; transferring a Micro LED chip to the bottom electrode; preparing a first passivation layer and totally covering the first passivation layer on the surface of the planar layer; opening a via hole on the surface of the first passivation layer for exposing the Micro LED chip; preparing a top electrode in the via hole.


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