The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2019
Filed:
Jun. 19, 2018
Applicant:
Protec Co., Ltd., Gyeonggi-do, KR;
Inventor:
Geunsik Ahn, Seoul, KR;
Assignee:
PROTEC CO., LTD., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 21/46 (2006.01); H01L 23/00 (2006.01); B23K 1/005 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); B23K 1/0056 (2013.01); H01L 24/17 (2013.01); H01L 24/742 (2013.01); H01L 24/81 (2013.01); H01L 2224/753 (2013.01); H01L 2224/75261 (2013.01); H01L 2224/81224 (2013.01); H01L 2224/83203 (2013.01);
Abstract
Provided are a flip chip laser bonding apparatus and a flip chip laser bonding method, and more particularly, to an apparatus and method for flip chip laser bonding, in which a semiconductor chip in a flip chip form is bonded to a substrate by using a laser beam. According to the flip chip laser bonding apparatus and the flip chip laser bonding method, even a semiconductor chip that is bent or is likely to bend may also be bonded to a substrate without contact failure of solder bumps by bonding the semiconductor chip to the substrate by laser bonding while pressurizing the semiconductor chip.