logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10495840 B1

PDFFull Text
Date of Patent:
Dec. 03, 2019

Filed:

Mar. 30, 2017

Copper-titanium alloy foil having plated layer

Applicant:

Jx Nippon Mining & Metals Corporation, Tokyo, JP;

Inventor:

Kenta Tsujie, Kanagawa, JP;

Assignee:

JX Nippon Mining & Metals Corporation, Tokyo, JP;

Attorney:

Marshall Gerstein & Borun LLP

Primary Examiner:

Michael E La Villa

Int. Cl.
CPC ...
G02B 7/02 (2006.01); G02B 7/10 (2006.01); C22C 9/00 (2006.01); C25D 7/06 (2006.01); C25D 3/30 (2006.01); B32B 15/01 (2006.01); B23K 1/00 (2006.01); C22C 9/05 (2006.01); C22C 9/06 (2006.01); B32B 15/04 (2006.01); C23C 30/00 (2006.01); C23C 2/08 (2006.01); C22C 9/10 (2006.01); B32B 15/20 (2006.01); B23K 1/19 (2006.01); B23K 1/20 (2006.01); G02B 7/09 (2006.01); B23K 101/36 (2006.01); B23K 103/12 (2006.01); B23K 103/18 (2006.01);
U.S. Cl.
CPC ...
G02B 7/026 (2013.01); B23K 1/0016 (2013.01); B23K 1/19 (2013.01); B23K 1/20 (2013.01); B32B 15/01 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/20 (2013.01); C22C 9/00 (2013.01); C22C 9/05 (2013.01); C22C 9/06 (2013.01); C22C 9/10 (2013.01); C23C 2/08 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); C25D 3/30 (2013.01); C25D 7/0614 (2013.01); G02B 7/09 (2013.01); G02B 7/10 (2013.01); B23K 2101/36 (2018.08); B23K 2103/12 (2018.08); B23K 2103/18 (2018.08); Y10T 428/12438 (2015.01); Y10T 428/12451 (2015.01); Y10T 428/12472 (2015.01); Y10T 428/12715 (2015.01); Y10T 428/12882 (2015.01); Y10T 428/12903 (2015.01); Y10T 428/12993 (2015.01); Y10T 428/26 (2015.01);
Abstract

The present invention provides a titanium copper foil having improved adhesion to solder and higher resistance to discoloration due to a high temperature and high humidity environment, an acid solution or an alkaline solution, and as well as having improved etching processability. The present invention provides a titanium copper foil comprising a base metal, the base metal having a composition containing Ti of from 1.5 to 5.0% by mass, the balance being copper and inevitable impurities, and having a thickness of from 0.018 to 0.1 mm, wherein the titanium copper foil has an Sn plated layer on a surface of the base metal, and has an adhesive strength of 0.5 N or more as measured by a solder adhesive strength test according to the definition in the specification.

Find Patent Forward Citations

Loading…