The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2019
Filed:
May. 01, 2017
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventors:
Tomohiro Shima, Yokohama, JP;
Kei Oikawa, Kawasaki, JP;
Yusuke Iwaki, Yokohama, JP;
Koki Kodaira, Tokyo, JP;
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 1/04 (2006.01); B29C 45/00 (2006.01); B29C 45/37 (2006.01); B29D 11/00 (2006.01); G02B 7/14 (2006.01); B29K 69/00 (2006.01); B29K 105/16 (2006.01); B29K 509/08 (2006.01); B29K 105/12 (2006.01);
U.S. Cl.
CPC ...
G02B 1/041 (2013.01); B29C 45/0005 (2013.01); B29C 45/0013 (2013.01); B29C 45/37 (2013.01); B29C 45/372 (2013.01); B29D 11/00009 (2013.01); G02B 7/14 (2013.01); B29K 2069/00 (2013.01); B29K 2105/122 (2013.01); B29K 2105/16 (2013.01); B29K 2509/08 (2013.01); B29K 2995/0022 (2013.01); Y10T 428/1352 (2015.01);
Abstract
A filler-containing resin molded product with a surface which includes irregularities which are transferred from a mold cavity to the surface and have an arithmetic mean roughness of 0.8 μm or greater and 10 μm or less and a peak arithmetic mean curvature of 400 [1/mm] or greater and 900 [1/mm] or less.