The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2019
Filed:
Aug. 23, 2016
Mitsubishi Electric Corporation, Tokyo, JP;
Nicolas Degrenne, Rennes, FR;
Stefan Mollov, Rennes, FR;
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Abstract
The present invention concerns a system for determining if a deterioration occurs in an interface of a semiconductor die of an electric power module, the electric power module further comprising a substrate and at least one electromechanical transductor, the semiconductor die and the at least one electromechanical transductor being placed on or embedded within the substrate, wherein the system comprises: —means for transferring at least one electric signal to the at least one electromechanical transductor, —means for measuring the impedance of the at least one electromechanical transductor, —means for comparing the impedance of the at least one electromechanical transductor to a predetermined value, —means for deciding that the deterioration occurs in the interface of the semiconductor die according to the comparison result.