The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2019
Filed:
Jul. 07, 2016
Mitsubishi Electric Corporation, Tokyo, JP;
Takaya Noguchi, Tokyo, JP;
Akira Okada, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
An evaluation apparatus for a semiconductor device includes: a chuck stage that has a surface on which a plurality of probe holes are formed and sucks a semiconductor device; and a plurality of in-chuck probes that have first ends which are inserted into the respective probe holes, and second ends which protrude from the surface of the chuck stage, and come into contact with an arrangement surface of the semiconductor device arranged in the chuck stage, wherein a height protruding from the surface of the chuck stage of at least one of the in-chuck probes is different from a height protruding from the surface of the chuck stage of the other in-chuck probe.