The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2019
Filed:
Oct. 18, 2016
The Aerospace Corporation, El Segundo, CA (US);
Yong Min Kim, Torrance, CA (US);
Joseph T Case, Hawthorne, CA (US);
Shant Kenderian, Pasadena, CA (US);
The Aerospace Corporation, El Segundo, CA (US);
Abstract
An ultrasonic inspection technique may be used to inspect quality of a bond between thermal protection system (TPS) material and a composite. The technique may include a highly damped transducer emitting an incident wave, which may traverse through thermal protection system (TPS) material and to a back wall of a composite. The incident wave may be of a low frequency signal, and may return a bondline echo and a backwall echo. The bondline echo is returned when the incident wave reaches a bondline and the backwall echo is returned when the incident wave reaches the backwall of the composite. The bondline echo and the backwall echo may be used to generate a waveform to assess the bond quality, revealing possible unbonds or kissing unbonds.