The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2019

Filed:

Jul. 03, 2015
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Keisuke Takayama, Tokyo, JP;

Hiroyuki Tachibana, Tokyo, JP;

Toru Koide, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25B 31/02 (2006.01); F04B 39/06 (2006.01); F04B 39/00 (2006.01); F25B 30/02 (2006.01);
U.S. Cl.
CPC ...
F25B 31/026 (2013.01); F04B 39/0061 (2013.01); F04B 39/06 (2013.01); F25B 30/02 (2013.01); F25B 2500/12 (2013.01); F25B 2500/13 (2013.01);
Abstract

A heat pump device includes a compression mechanism for compressing refrigerant, a motor for driving the compression mechanism, a shell housing the compression mechanism and the motor, a discharge muffler located outside the shell, a first pipe connecting the compression mechanism to the discharge muffler, and a thermal insulator (a first thermal insulating material and a second thermal insulating material). The shell and the discharge muffler are spatially located next to each other without being in contact with each other. The thermal insulator is at least partially located in a space where a distance between an outer surface of the shell and an outer surface of the discharge muffler is minimum.


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