The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2019

Filed:

Mar. 04, 2016
Applicant:

Huntsman Advanced Materials Americas Llc, The Woodlands, TX (US);

Inventors:

Dong Wang, The Woodlands, TX (US);

Bradley Rechichar, The Woodlands, TX (US);

Derek S. Kincaid, Spring, TX (US);

Ronald C. Smith, Jr., Conroe, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08L 61/34 (2006.01); C07D 265/14 (2006.01); C08J 5/04 (2006.01); C08G 14/06 (2006.01); C09D 161/06 (2006.01); C09D 161/34 (2006.01); C09J 161/06 (2006.01); C09J 161/34 (2006.01); C08L 61/06 (2006.01); C07D 413/14 (2006.01); C07D 265/16 (2006.01); C08J 5/24 (2006.01); C08K 5/34 (2006.01); C08G 73/22 (2006.01);
U.S. Cl.
CPC ...
C08L 61/34 (2013.01); C07D 265/14 (2013.01); C07D 265/16 (2013.01); C07D 413/14 (2013.01); C08G 14/06 (2013.01); C08G 73/22 (2013.01); C08J 5/04 (2013.01); C08J 5/043 (2013.01); C08J 5/24 (2013.01); C08K 5/34 (2013.01); C08L 61/06 (2013.01); C09D 161/06 (2013.01); C09D 161/34 (2013.01); C09J 161/06 (2013.01); C09J 161/34 (2013.01); C08J 2361/34 (2013.01); C08J 2379/00 (2013.01); C08J 2461/06 (2013.01); C08J 2463/04 (2013.01); C08L 2201/08 (2013.01); C09J 2461/00 (2013.01); C09J 2463/00 (2013.01);
Abstract

The present disclosure provides an organic sulfur acid-free composition containing a benzoxazine, phenolic compound and nitrogen-containing heterocyclic compound. The organic sulfur acid-free composition, upon curing at temperatures as low as 130°-140° C., renders void free cured articles having well balanced thermal, chemical and mechanical properties. The organic sulfur acid-free composition may be used in a variety of applications, such as in coatings, structural and non-structural composites and encapsulating systems for electronic and electrical components.


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