The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2019
Filed:
May. 13, 2016
Mitsubishi Chemical Corporation, Chiyoda-ku, JP;
Akira Oota, Chiyoda-ku, JP;
Masahiro Ichino, Chiyoda-ku, JP;
Takuya Teranishi, Chiyoda-ku, JP;
Tooru Kondou, Chiyoda-ku, JP;
Mitsuru Kutsuwada, Chiyoda-ku, JP;
Mitsubishi Chemical Corporation, Chiyoda-ku, JP;
Abstract
A sheet-molding compound comprising a thickened thermosetting resin composition and reinforcing fiber bundles. The thermosetting resin composition comprises components (A), (B) and (D). The content of component (D) is 10 parts by mass to 30 parts by mass with respect to 100 parts by mass of the total amount of epoxy resin. The final viscosity of the thickened thermosetting resin composition is 150 Pa·s to 20000 Pa·s, and the minimum viscosity is 2 Pa·s to 600 Pa·s, the final viscosity being higher than the minimum viscosity.