The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2019

Filed:

Sep. 06, 2017
Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventors:

Masayoshi Adachi, Yokkaichi, JP;

Jun Takagi, Yokkaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/10 (2012.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01L 21/306 (2006.01); B24B 37/013 (2012.01);
U.S. Cl.
CPC ...
B24B 37/107 (2013.01); B24B 37/013 (2013.01); H01L 21/30625 (2013.01); H01L 21/6708 (2013.01); H01L 21/67248 (2013.01); H01L 21/67253 (2013.01); H01L 21/68735 (2013.01); H01L 21/68764 (2013.01);
Abstract

A semiconductor manufacturing apparatus according to the present embodiment has a polisher polishing a substrate. A holder holds the substrate and rotates the substrate with respect to the polisher while pressing the substrate toward the polisher. A supplier supplies a polishing solution onto the polisher. A first annular part is attached to the holder. The first annular part is located around the substrate and between the holder and the polisher, when polishing the substrate. A second annular part is attached to the holder. The second annular part is located around the first annular part and between the holder and the polisher, when polishing the substrate. The first annular part is movable relative to the second annular part or the second annular part is movable relative to the first annular part, in a rotation direction of the substrate or the holder.


Find Patent Forward Citations

Adachi, Masayoshi. (2019). Semiconductor manufacturing apparatus and manufacturing method of semiconductor device (U.S. Patent No. 10493592). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10493592

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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