The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2019
Filed:
Dec. 15, 2014
Applicant:
Hyundai Steel Company, Incheon, KR;
Inventors:
Nam-Kyu Shin, Busan, KR;
Seung-Man Nam, Seoul, KR;
Myeong-Jin Lee, Gyeonggi-do, KR;
Yun-Tae Kim, Chungcheongnam-do, KR;
Assignee:
Hyundai Steel Company, Incheon, KR;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B21D 37/18 (2006.01); B21D 22/02 (2006.01); C09D 183/04 (2006.01); C08G 77/00 (2006.01); C21D 7/13 (2006.01); B21D 22/00 (2006.01); B21D 37/16 (2006.01);
U.S. Cl.
CPC ...
B21D 37/18 (2013.01); B21D 22/022 (2013.01); C09D 183/04 (2013.01); B21D 22/00 (2013.01); B21D 37/16 (2013.01); C08G 77/80 (2013.01); C21D 7/13 (2013.01);
Abstract
Disclosed is a hot stamping device and method for preventing plating from sticking to a die. The hot stamping device may include a die that receives a heated plating material, presses the received plating material, and rapidly cools the pressed plating material in a constrained state. Before the plating material is pressed, an anti-sticking layer may be formed on the surface of the die disposed in contact with the plating material.