The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2019

Filed:

Apr. 06, 2018
Applicant:

Laird Technologies, Inc.;

Inventors:

Richard Tsai, Xinbei, TW;

Dusan Lee, Shenzhen, CN;

Larry Don Creasy, Jr., St. Clair, MO (US);

Assignee:

Other;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H05K 3/38 (2006.01); C23C 18/16 (2006.01); C23C 18/38 (2006.01); C23C 18/20 (2006.01); C23C 18/30 (2006.01); C23C 18/40 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0084 (2013.01); C23C 18/161 (2013.01); C23C 18/163 (2013.01); C23C 18/1605 (2013.01); C23C 18/1608 (2013.01); C23C 18/1614 (2013.01); C23C 18/1641 (2013.01); C23C 18/1646 (2013.01); C23C 18/1653 (2013.01); C23C 18/2066 (2013.01); C23C 18/30 (2013.01); C23C 18/38 (2013.01); H05K 3/381 (2013.01); C23C 18/405 (2013.01); Y10T 428/24802 (2015.01); Y10T 428/24826 (2015.01); Y10T 428/2962 (2015.01); Y10T 428/31786 (2015.04);
Abstract

According to various aspects, exemplary embodiments are disclosed of selectively metal-plated rolls of materials, rolls of materials configured for selective metal plating, and methods for selectively plating rolls of materials. In an exemplary embodiment, a roll of material includes a substrate. An insulating ink is on the substrate. A catalyst coating is on the substrate whereat the insulating ink is not present. The catalyst coating may be configured to provide the substrate with one or more catalytic surfaces suitable for electroless deposition of metal. Accordingly, metal plating may be electrolessly deposited on the catalyst coating without over-plating the insulating ink.


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