The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2019
Filed:
Sep. 15, 2017
Applicant:
Industrial Technology Research Institute, Hsinchu, TW;
Inventors:
Chun-Kai Liu, Taipei, TW;
Yu-Lin Chao, Hsinchu, TW;
Assignee:
Industrial Technology Research Institute, Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 7/14 (2006.01); H05K 1/02 (2006.01); H01L 23/473 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20927 (2013.01); H01L 23/473 (2013.01); H01L 25/07 (2013.01); H05K 1/028 (2013.01); H05K 7/1432 (2013.01); H05K 7/20918 (2013.01);
Abstract
A power module including a plurality of substrates, a plurality of power devices, and a heat dissipation assembly is provided. The substrates are located on different planes and surround an axis. Each of the substrates extends along the axis. The power devices electrically connected with each other are disposed on the substrates respectively. The heat dissipation assembly is disposed on the substrates and opposite to the power devices. Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.