The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10492304 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 26, 2019

Filed:

Feb. 03, 2017
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Masayuki Sakai, Yokohama, JP;

Takahiro Yoneyama, Tokyo, JP;

Fumiyuki Yamatsuka, Moriya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/34 (2006.01); G03G 15/00 (2006.01); B23K 1/00 (2006.01); B23K 101/36 (2006.01); B23K 101/42 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3431 (2013.01); B23K 1/0016 (2013.01); G03G 15/5054 (2013.01); G03G 15/80 (2013.01); H05K 3/3452 (2013.01); B23K 2101/36 (2018.08); B23K 2101/42 (2018.08); G03G 2215/0132 (2013.01); G03G 2215/0164 (2013.01); G03G 2215/16 (2013.01); H05K 1/181 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10484 (2013.01); H05K 2203/0465 (2013.01); Y02P 70/613 (2015.11);
Abstract

The circuit substrate includes at least two lands formed on a substrate, wherein one electrode is to be mounted on the at least two lands, an electronic part having electrodes, one of the electrodes is soldered on the at least two lands with solders whose amounts are adjusted by a metal mask having at least two opening parts, positions of the at least two opening parts corresponding to the at least two lands when the solders are applied and melted, areas of the at least two opening parts being different with each other, wherein a height of one of the solders is different from a height of the other of the solders according to the difference of the areas of the at least two opening parts of the metal mask, whereby the electronic part is mounted on the circuit substrate in an inclined state.


Find Patent Forward Citations

Sakai, Masayuki. (2019). Method of mounting electronic part, circuit substrate, and image forming apparatus (U.S. Patent No. 10492304). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10492304

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