The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2019
Filed:
Sep. 05, 2016
Applicant:
Mitsubishi Heavy Industries Thermal Systems, Ltd., Tokyo, JP;
Inventors:
Makoto Hattori, Tokyo, JP;
Hiroyuki Kamitani, Tokyo, JP;
Hiroto Higuchi, Tokyo, JP;
Takayuki Takashige, Tokyo, JP;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/34 (2006.01); B60H 1/32 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01); F04B 39/00 (2006.01); B60R 16/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/34 (2013.01); B60H 1/3222 (2013.01); F04B 39/00 (2013.01); H05K 1/18 (2013.01); H05K 3/3452 (2013.01); H05K 3/3489 (2013.01); H05K 3/4644 (2013.01); B60H 2001/3292 (2013.01); B60R 16/02 (2013.01); H05K 2203/122 (2013.01);
Abstract
A substrate includes a substrate body, a flux coating portion which is coated with flux promoting solder fluidity on a surface of the substrate body, a conduction portion which is disposed on the surface of the substrate body to be separated from the flux coating portion and is conductive, and a silk portion which is disposed between the flux coating portion and the conduction portion on the surface of the substrate body and is provided by silk printing.