The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2019

Filed:

Oct. 12, 2016
Applicant:

Fujikura Ltd., Tokyo, JP;

Inventors:

Yasuo Fukuda, Tokyo, JP;

Takayuki Okamura, Akita, JP;

Assignee:

FUJIKURA LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/09 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0281 (2013.01); H05K 1/09 (2013.01); H05K 1/11 (2013.01); H05K 1/147 (2013.01); H05K 2201/032 (2013.01); H05K 2201/0332 (2013.01);
Abstract

A printed wiring board includes: an insulating base material; a first conductive layer disposed on a main surface of the insulating base material in a first region and a second region defined on a plane along the main surface; a second conductive layer disposed on a main surface of the first conductive layer in the first region; and an insulating layer disposed on the main surface of the first conductive layer in the second region. The ratio of a first evaluation value E1 to a second evaluation value E2 is 0.91 or more and 0.99 or less. The first evaluation value E1 is an evaluation value of strength of a first laminated part in the first region and the second evaluation value E2 is an evaluation value of strength of a second laminated part in the second region.


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