The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2019
Filed:
Apr. 14, 2017
Applicant:
Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;
Inventors:
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); H05K 1/02 (2006.01); G02B 6/122 (2006.01); G02B 6/12 (2006.01); G02B 6/138 (2006.01); G02B 6/43 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0274 (2013.01); G02B 6/122 (2013.01); G02B 6/12002 (2013.01); G02B 6/138 (2013.01); H05K 1/02 (2013.01); H05K 1/0271 (2013.01); G02B 6/428 (2013.01); G02B 6/43 (2013.01);
Abstract
An optical circuit board sheet which has little or no warpage to have no cracking in cores, and an opto-electric hybrid board sheet including the same are provided. The optical circuit board sheet includes: an insulative sheet; an under cladding layer formed on a first surface of the insulative sheet; and at least one core formed on a surface of the under cladding layer. A hole is formed in a portion of the surface of the under cladding layer other than where the core is formed. The area percentage of an opening area of the hole is in the range of 5% to 99% with respect to the first surface of the insulative sheet.