The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2019

Filed:

Jun. 15, 2018
Applicant:

Advanced Optoelectronic Technology, Inc., Hsinchu Hsien, TW;

Inventor:

Chin-Fu Cheng, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/50 (2010.01); H01L 33/60 (2010.01); H01L 33/36 (2010.01); H01L 33/32 (2010.01); H01L 33/52 (2010.01); H01L 33/00 (2010.01); H01L 33/30 (2010.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 33/0079 (2013.01); H01L 33/30 (2013.01); H01L 33/32 (2013.01); H01L 33/36 (2013.01); H01L 33/505 (2013.01); H01L 33/52 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01);
Abstract

A light emitting diode package includes a light emitting diode chip, a light conversion layer covering the light emitting diode chip, a reflecting layer surrounding the light emitting diode chip. The light emitting chip has a light output top surface, a first electrode and a second electrode. The first electrode and the second electrode are opposite to the light output top surface. The light emitting diode package further includes a supporting layer made of metal material. The supporting layer is mounted on a bottom surface of the reflecting layer facing away from the light output top surface and surrounds the light emitting chip and the light conversion layer.


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