The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2019

Filed:

Jan. 12, 2017
Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventor:

Naohiro Sugiyama, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 29/16 (2006.01); C30B 25/20 (2006.01); C30B 29/36 (2006.01); H01L 21/205 (2006.01); H01L 21/02 (2006.01); H01L 29/861 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1608 (2013.01); C30B 25/20 (2013.01); C30B 29/36 (2013.01); H01L 21/02293 (2013.01); H01L 21/02378 (2013.01); H01L 21/205 (2013.01); H01L 29/8611 (2013.01);
Abstract

In a semiconductor substrate having a silicon carbide substrate and an epitaxial film, a concentration ratio between a hydrogen concentration in the silicon carbide substrate and a hydrogen concentration in the epitaxial film is in a range between 0.2 and 5, preferably in a range between 0.5 and 2. Thus, hydrogen diffusion at a boundary position between the epitaxial film and the SiC substrate is restricted. Further, it is possible to prepare the semiconductor substrate for restricting the reduction of the hydrogen concentration. Thus, it is possible to improve the properties of the SiC semiconductor device using the semiconductor substrate, for example, the bipolar device such as a PN diode.


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