The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2019
Filed:
Sep. 16, 2016
Applicant:
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Inventors:
Larry Duane Kinsman, Boise, ID (US);
Swarnal Borthakur, Boise, ID (US);
Marc Allen Sulfridge, Boise, ID (US);
Assignee:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/00 (2006.01); H01L 27/146 (2006.01); H01L 31/0203 (2014.01); H01L 21/56 (2006.01); H01L 23/373 (2006.01); H01L 31/024 (2014.01);
U.S. Cl.
CPC ...
H01L 27/14634 (2013.01); H01L 21/563 (2013.01); H01L 23/373 (2013.01); H01L 23/3732 (2013.01); H01L 27/1462 (2013.01); H01L 27/1469 (2013.01); H01L 27/14601 (2013.01); H01L 27/14636 (2013.01); H01L 31/0203 (2013.01); H01L 31/024 (2013.01);
Abstract
Various embodiments of the present technology may comprise a method and apparatus for an image sensor with a thermal equalizer for distributing heat. The method and apparatus may comprise a thermal equalizer disposed between a sensor die and a circuit die to prevent uneven heating of the pixels in the sensor die. The method and apparatus may comprise a thermal equalizer integrated within the circuit die.