The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2019

Filed:

May. 30, 2016
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Hyun-Chul Sagong, Hwasung, KR;

Sang-Woo Pae, Seongnam-si, KR;

Seung-Jin Choo, Suwon-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/367 (2006.01); H01L 27/092 (2006.01); H01L 29/06 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01); H01L 29/775 (2006.01); H01L 29/786 (2006.01); B82Y 10/00 (2011.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H01L 23/3731 (2013.01); H01L 23/3738 (2013.01); H01L 27/092 (2013.01); H01L 29/0673 (2013.01); H01L 29/42392 (2013.01); H01L 29/66439 (2013.01); H01L 29/66772 (2013.01); H01L 29/775 (2013.01); H01L 29/78603 (2013.01); H01L 29/78654 (2013.01); H01L 29/78684 (2013.01); H01L 29/78696 (2013.01); B82Y 10/00 (2013.01); H01L 27/0211 (2013.01); H01L 29/66469 (2013.01);
Abstract

A semiconductor device includes a substrate, a thermal conduction layer on the substrate, a first wire pattern on the thermal conduction layer, a first semiconductor pattern a second semiconductor pattern, and a gate electrode between the first semiconductor pattern and the second semiconductor pattern. The gate electrode surrounds a periphery of the first wire pattern. A concentration of impurity of the thermal conduction layer is different from that of the substrate. The first wire pattern includes a first end and a second end. The concentration of impurity contained in the first wire pattern is higher than that contained in the thermal conduction layer and that contained in the substrate. The first semiconductor pattern is in contact with the first end of the first wire pattern and the thermal conduction layer. The second semiconductor pattern is in contact with the second end of the first wire pattern.


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