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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10490469 B1

PDFFull Text
Date of Patent:
Nov. 26, 2019

Filed:

Oct. 28, 2015

Power converting device

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventor:

Masakazu Tani, Tokyo, JP;

Assignee:

Mitsubishi Electric Corporation, Tokyo, JP;

Attorneys:

Sughrue Mion, PLLC

Richard C. Turner

Primary Examiner:

Jue Zhang

Assistant Examiner:

Bart Iliya

Int. Cl.
CPC ...
H01L 23/13 (2006.01); H02M 7/00 (2006.01); H01L 25/16 (2006.01); H02M 7/48 (2007.01); H02M 1/44 (2007.01); H01L 25/18 (2006.01); H01L 25/07 (2006.01); H01L 23/36 (2006.01); H05K 7/14 (2006.01); H01L 23/367 (2006.01); H01L 23/427 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H01L 23/13 (2013.01); H01L 23/36 (2013.01); H01L 25/07 (2013.01); H01L 25/16 (2013.01); H01L 25/18 (2013.01); H02M 1/44 (2013.01); H02M 7/003 (2013.01); H02M 7/48 (2013.01); H05K 7/1432 (2013.01); H01L 23/367 (2013.01); H01L 23/427 (2013.01); H01L 23/473 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/30107 (2013.01);
Abstract

In a power converting device, an anode lead plate and a cathode lead plate are disposed opposed in an interior of an insulating plate, whereby the respective current directions are opposed and a magnetic field is negated, because of which inductance is reduced. Also, as external connection terminals, which are end portions of the anode lead plate and the cathode lead plate, pass through the interior of the insulating plate and are disposed in another space of the case from a lower portion of the insulating plate, the wiring distance between a capacitor element and a power semiconductor module is short, and inductance can be reduced.

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