The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2019

Filed:

Nov. 01, 2017
Applicant:

SK Hynix Inc., Gyeonggi-do, KR;

Inventors:

Hae-Jung Park, Gyeonggi-do, KR;

Jung-Taik Cheong, Gyeonggi-do, KR;

Tae-Woo Jung, Gyeonggi-do, KR;

Yun-Je Choi, Gyeonggi-do, KR;

Assignee:

SK hynix Inc., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 29/06 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 27/108 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7682 (2013.01); H01L 21/76834 (2013.01); H01L 21/76877 (2013.01); H01L 21/76897 (2013.01); H01L 23/528 (2013.01); H01L 23/5329 (2013.01); H01L 27/10888 (2013.01); H01L 29/0649 (2013.01); H01L 29/0653 (2013.01); H01L 29/66621 (2013.01);
Abstract

A semiconductor device may include: a substrate having first and second surfaces; an interlayer dielectric layer having a first opening to expose the first surface; a first plug positioned in the first opening and isolated from a sidewall of the first opening by a pair of gaps; a bit line extended in any one direction while covering the first plug; a second plug including a lower part adjacent to the first plug and an upper part adjacent to the bit line, and connected to the second surface; a first air gap positioned between the first plug and the lower part of the second plug; and a second air gap positioned between the bit line and the upper part of the second plug, and having a larger width than the first air gap.


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