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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10490422 B1

PDFFull Text
Date of Patent:
Nov. 26, 2019

Filed:

Oct. 06, 2015

Manufacturing method for semiconductor device

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Tetsuya Ueda, Tokyo, JP;

Hiroshi Yoshida, Tokyo, JP;

Seiji Oka, Tokyo, JP;

Ken Sakamoto, Tokyo, JP;

Assignee:

Mitsubishi Electric Corporation, Tokyo, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Telly D Green

Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/48 (2006.01); B29C 45/14 (2006.01); H01L 21/67 (2006.01); H01L 23/495 (2006.01); H01L 25/065 (2006.01); B29L 31/34 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/565 (2013.01); B29C 45/14065 (2013.01); B29C 45/14639 (2013.01); H01L 21/56 (2013.01); H01L 21/67126 (2013.01); H01L 23/48 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); H01L 25/0655 (2013.01); B29C 2045/14163 (2013.01); B29L 2031/3406 (2013.01); H01L 23/3121 (2013.01); H01L 24/48 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48101 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48245 (2013.01); H01L 2924/181 (2013.01);
Abstract

An object is to provide a technology that reduces the number of components and that is capable of suppressing the cost. A structure including semiconductor elements, a plurality of electrode terminals, and a dam bar for connecting the plurality of electrode terminals is prepared, and a part of the structure including a part of the plurality of electrode terminals and the dam bar is arranged in the terminal hole. Further, the part of the structure is clamped by a movable clamp inside the terminal hole, and at least a portion of the movable clamp is fitted into the terminal hole, and then a resin is injected into an internal space of a pair of molds.

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