The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2019

Filed:

Sep. 14, 2017
Applicant:

The Board of Trustees of the University of Illinois, Urbana, IL (US);

Inventors:

Xiuling Li, Champaign, IL (US);

Wen Huang, Champaign, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 5/04 (2006.01); H01L 49/02 (2006.01); H01F 17/00 (2006.01); H01F 17/02 (2006.01);
U.S. Cl.
CPC ...
H01F 5/003 (2013.01); H01F 5/04 (2013.01); H01F 17/0006 (2013.01); H01F 17/02 (2013.01); H01L 28/10 (2013.01); H01F 2005/006 (2013.01);
Abstract

An array of rolled-up power inductors for on-chip applications comprises at least two rolled-up power inductors connected in series and formed from a stack of multilayer sheets. The array includes a first rolled-up power inductor comprising a first multilayer sheet in a rolled configuration about a first longitudinal axis and second rolled-up power inductor comprising a second multilayer sheet in a rolled configuration about a second longitudinal axis. The first and second rolled-up power inductors are laterally spaced apart. The first multilayer sheet comprises a first patterned conductive layer on a first strain-relieved layer, and the second multilayer sheet comprises a second patterned conductive layer on a second strain-relieved layer. Prior to roll-up of the second and first multilayer sheets, the second multilayer sheet is disposed on the first multilayer sheet, and a through-thickness first via connects the second patterned conductive layer with the first patterned conductive layer.


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