The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2019
Filed:
May. 29, 2019
Headway Technologies, Inc., Milpitas, CA (US);
Yue Liu, Fremont, CA (US);
Ying Liu, San Jose, CA (US);
Yuhui Tang, Milpitas, CA (US);
Jiun-Ting Lee, Sunnyvale, CA (US);
Moris Dovek, San Jose, CA (US);
Yiming Wang, San Jose, CA (US);
Headway Technologies, Inc., Milpitas, CA (US);
Abstract
A method of forming a PMR writer with an all wrap around (AWA) shield design in which one or more of the leading shield, side shields, and trailing shield (TS) structure (except the hot seed layer) at the air bearing surface (ABS) are comprised of an alloy having a damping parameter α of ≥0.04 to minimize wide area track erasure (WATE). The TS structure comprises two outer magnetic layers with an 8-16 kiloGauss (kG) saturation magnetic moment (Ms) on each side of a center stack with a lower write gap, a middle hot seed layer (Ms of 19-24 kG), and an upper magnetic layer (Ms of 16-24 kG). The hot seed layer and upper TS magnetic layer promote improved area density capability (ADC). A second TS layer with Ms of 16-24 kG and a full width at the ABS may be formed on the upper magnetic layer.