The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2019

Filed:

Jun. 22, 2017
Applicants:

Daicel Corporation, Osaka-shi, Osaka, JP;

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventors:

Yasunobu Nakagawa, Himeji, JP;

Takeshi Yoshida, Ohtake, JP;

Satoru Ogawa, Anan, JP;

Masafumi Kuramoto, Anan, JP;

Masahide Bando, Anan, JP;

Assignees:

DAICEL CORPORATION, Osaka-Shi, JP;

NICHIA CORPORATION, Anan-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 19/04 (2006.01); G01N 33/44 (2006.01); C09J 183/06 (2006.01); H01L 33/56 (2010.01); C09J 183/04 (2006.01); C08G 77/20 (2006.01); C08G 77/50 (2006.01);
U.S. Cl.
CPC ...
G01N 19/04 (2013.01); C09J 183/04 (2013.01); C09J 183/06 (2013.01); G01N 33/442 (2013.01); G01N 33/445 (2013.01); H01L 33/56 (2013.01); C08G 77/20 (2013.01); C08G 77/50 (2013.01);
Abstract

Provided is a curable resin composition which can be cured to form a material (cured product) that has low tack properties and resists adhesion of garbage. The present invention provides a curable resin composition comprising polysiloxane (A) having not less than 2 alkenyl groups in the molecule and polysiloxane (B) having not less than 2 hydrosilyl groups in the molecule, wherein (T+Q)/D>0.3 and M+D+T+Q=1 are satisfied regarding all silicon atoms contained therein, the amount of the hydrosilyl groups with respect to 1 mol of aliphatic carbon-carbon double bonds present therein is 0.9 to 5.0 mol, and a cured product of the curable resin composition exhibits a separation strength of not more than 0.40 N per mmin separation load evaluation and/or a total separation load of not more than 0.018 N·mm per mm.


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