The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2019

Filed:

Jan. 29, 2019
Applicant:

Lumens Co., Ltd., Yongin-si, Gyeonggi-Do, KR;

Inventors:

Dae Won Kim, Yongin-si, KR;

Yong Wook Cho, Yongin-si, KR;

Min Pyo Kim, Yongin-si, KR;

Jung Hye Park, Yongin-si, KR;

Won Kook Son, Yongin-si, KR;

Assignee:

LUMENS CO., LTD., Yongin-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F21S 4/28 (2016.01); H01L 27/15 (2006.01); H01L 33/62 (2010.01); H01L 33/50 (2010.01); H01L 33/52 (2010.01); F21K 9/232 (2016.01); F21V 23/06 (2006.01); F21V 3/02 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); F21Y 115/10 (2016.01); F21Y 107/00 (2016.01); F21K 9/66 (2016.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
F21S 4/28 (2016.01); F21K 9/232 (2016.08); F21V 23/06 (2013.01); H01L 27/156 (2013.01); H01L 33/507 (2013.01); H01L 33/52 (2013.01); H01L 33/62 (2013.01); F21K 9/66 (2016.08); F21V 3/02 (2013.01); F21Y 2107/00 (2016.08); F21Y 2115/10 (2016.08); H01L 25/0753 (2013.01); H01L 2224/16245 (2013.01); H05K 1/0274 (2013.01); H05K 1/181 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/10106 (2013.01);
Abstract

A filament type light emitting bulb including a base, a light transmitting globe coupled to a front opening of the base, a pair of leads, and a plurality of light emitting devices, said one of the light emitting devices includes a non-conductive substrate; a first light emitting diode chip, a second light emitting diode chip and nth, where n≥1, light emitting diode chip mounted on the upper surface of the non-conductive substrate and each comprising input and output ends; two connection means including a first connection mean adjacent to the first light emitting diode chip connected an input terminal and a second connection mean adjacent to the nth light emitting diode chip connected an output terminal; two extending terminals connected the first connection mean and the second connection mean respectively; and a light transmitting encapsulant covered the non-conductive substrate, the two connection means and partially covered the two extending terminals, wherein the nth light emitting diode chip formed a first electrode pad and a second electrode pad and connected on the non-conductive substrate through a first bump and a second bump respectively.


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