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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10487987 B1

PDFFull Text
Date of Patent:
Nov. 26, 2019

Filed:

Dec. 19, 2016

Led filament

Applicant:

Zhejiang Super Lighting Electric Appliance Co., Ltd, Jinyun, CN;

Inventors:

Tao Jiang, Jiaxing, CN;

Liqin Li, Jiaxing, CN;

Assignee:

ZHEJIANG SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD., Jinyun, CN;

Attorneys:

Im IP Law

C. Andrew Im

Cha Im

Primary Examiner:

Sean P Gramling

Int. Cl.
CPC ...
F21K 9/232 (2016.01); H01L 33/62 (2010.01); F21V 3/02 (2006.01); F21K 9/238 (2016.01); H01L 25/075 (2006.01); F21Y 115/10 (2016.01); F21V 3/06 (2018.01); F21Y 107/50 (2016.01); F21K 9/90 (2016.01); F21V 19/00 (2006.01); F21Y 103/33 (2016.01); F21Y 103/37 (2016.01); F21Y 107/00 (2016.01);
U.S. Cl.
CPC ...
F21K 9/232 (2016.08); F21K 9/238 (2016.08); F21V 3/02 (2013.01); H01L 33/62 (2013.01); F21K 9/90 (2013.01); F21V 3/061 (2018.02); F21V 3/062 (2018.02); F21V 19/003 (2013.01); F21Y 2103/33 (2016.08); F21Y 2103/37 (2016.08); F21Y 2107/00 (2016.08); F21Y 2107/50 (2016.08); F21Y 2115/10 (2016.08); H01L 25/0753 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/19107 (2013.01);
Abstract

An LED filament configured to emit omnidirectional light includes a linear array of LED chips operably interconnected to emit light upon energization and a conductive electrode. The linear array of LED chips is electrically connected with the conductive electrode. A light conversion coating encloses the linear array of the LED chip and the conductive electrode. The light conversion layer includes a top layer and a base layer conformally interconnected to form a unitary enclosure. The top layer is coated on a first side of the linear array of LED chips and the conductive electrode. The base layer is coated on a second side of the linear array of LED chips and the conductive electrode.

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