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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10487183 B1

PDFFull Text
Date of Patent:
Nov. 26, 2019

Filed:

Jun. 27, 2017

Method of bonding substrates and method of producing microchip

Applicant:

Ushio Denki Kabushiki Kaisha, Tokyo, JP;

Inventors:

Fumitoshi Takemoto, Tokyo, JP;

Shinji Suzuki, Tokyo, JP;

Motohiro Sakai, Tokyo, JP;

Kenichi Hirose, Tokyo, JP;

Assignee:

Ushio Denki Kabushiki Kaisha, Tokyo, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Carson Gross

Int. Cl.
CPC ...
C08J 5/12 (2006.01); C08J 7/12 (2006.01); H05K 3/30 (2006.01); B29C 65/02 (2006.01); B29C 65/00 (2006.01); B32B 37/06 (2006.01); B32B 17/06 (2006.01); B32B 38/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
C08J 5/121 (2013.01); B29C 65/02 (2013.01); B29C 66/028 (2013.01); B29C 66/7465 (2013.01); B32B 17/064 (2013.01); B32B 37/06 (2013.01); B32B 38/0008 (2013.01); C08J 7/123 (2013.01); H05K 3/305 (2013.01); B29L 2031/34 (2013.01); B32B 2457/00 (2013.01); C08J 2333/00 (2013.01); C08J 2345/00 (2013.01); H05K 2203/095 (2013.01);
Abstract

The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip. In the method of bonding substrates according to the present invention, the first substrate is formed of a material having a deformable temperature at which the substrate deforms and which is higher than a deformable temperature of the second substrate, the method includes: a surface activation step of activating each of bonding surfaces of the first substrate and the second substrate; a stacking step of stacking the first substrate and the second substrate so that the respective bonding surfaces thereof are in contact with each other; and a deforming step of deforming the bonding surface of the second substrate to conform to a shape of the bonding surface of the first substrate, and the deforming step is performed by heating the stacked body of the first substrate and the second substrate obtained in the stacking step at a temperature not lower than the deformable temperature of the second substrate and lower than the deformable temperature of the first substrate.

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