The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2019

Filed:

May. 30, 2018
Applicant:

Miramems Sensing Technology Co., Ltd, Suzhou, CN;

Inventors:

Li-Tien Tseng, Taoyuan, TW;

Yu-Hao Chien, Taipei, TW;

Chih-Liang Kuo, Hsinchu, TW;

Yu-Te Yeh, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); G01L 1/14 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0051 (2013.01); B81C 1/0023 (2013.01); G01L 1/148 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/04 (2013.01); B81B 2207/012 (2013.01); B81C 2203/0785 (2013.01);
Abstract

A force sensor comprises a first substrate, a second substrate, a third substrate, and a package body. The first substrate includes a fixed electrode, at least one first conductive contact, and at least one second conductive contact. The second substrate is disposed on the first substrate and electrically connected to the first conductive contact of the first substrate. The second substrate includes a micro-electro-mechanical system (MEMS) element corresponding to the fixed electrode. The third substrate is disposed on the second substrate and includes a pillar connected to the MEMS element. The package body covers the third substrate. The foregoing force sensor has better reliability.


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