The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2019
Filed:
Dec. 16, 2015
Applicant:
Adesso Advanced Materials Wuhu Co., Ltd., Wuhu, CN;
Assignee:
ADESSO ADVANCED MATERIALS WUHU CO., LTD., Wuhu, CN;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/092 (2006.01); B32B 27/26 (2006.01); B32B 27/38 (2006.01); C08L 63/00 (2006.01); B32B 15/20 (2006.01); C08G 59/50 (2006.01); C08G 59/54 (2006.01); C09J 163/00 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); C08J 5/24 (2006.01); B32B 19/02 (2006.01); B32B 19/04 (2006.01); B32B 27/08 (2006.01);
U.S. Cl.
CPC ...
B32B 15/092 (2013.01); B32B 15/20 (2013.01); B32B 19/02 (2013.01); B32B 19/041 (2013.01); B32B 27/08 (2013.01); B32B 27/26 (2013.01); B32B 27/38 (2013.01); C08G 59/50 (2013.01); C08G 59/504 (2013.01); C08G 59/54 (2013.01); C08J 5/24 (2013.01); C08L 63/00 (2013.01); C09J 163/00 (2013.01); H05K 1/0326 (2013.01); H05K 1/0366 (2013.01); H05K 3/00 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2307/716 (2013.01); B32B 2457/08 (2013.01); C08J 2363/02 (2013.01); C08K 2201/018 (2013.01); H05K 2201/012 (2013.01); H05K 2203/178 (2013.01); Y02P 70/611 (2015.11); Y02P 70/613 (2015.11);
Abstract
The present invention provides recyclable copper clad laminates (CCLs) each including copper foil and a recyclable/degradable fiber composition, and printed circuit boards that are made of or include the CCLs of this invention. Also provided are method for recycling these CCLs and printed circuit boards.