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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10486391 B1

PDFFull Text
Date of Patent:
Nov. 26, 2019

Filed:

Dec. 21, 2017

Bonded structure and method for manufacturing the same

Applicant:

Honda Motor Co., Ltd., Minato-ku, Tokyo, JP;

Inventors:

Katsuyuki Awano, Wako, JP;

Yasuhiko Saijo, Wako, JP;

Yoichi Toyooka, Wako, JP;

Masaaki Nishi, Wako, JP;

Assignee:

HONDA MOTOR CO., LTD., Tokyo, JP;

Attorney:

Amin, Turocy & Watson LLP

Primary Examiner:

Jeffrey A Vonch

Int. Cl.
CPC ...
B32B 3/30 (2006.01); B32B 15/04 (2006.01); B29C 65/00 (2006.01); B23K 26/352 (2014.01); C09J 5/02 (2006.01); B62D 29/00 (2006.01); B62D 21/11 (2006.01); B32B 7/12 (2006.01); B23B 3/30 (2006.01); B29C 65/54 (2006.01); B29L 31/30 (2006.01); B62D 27/02 (2006.01); B23K 26/324 (2014.01); B23B 3/26 (2006.01); B32B 15/18 (2006.01); B23K 26/00 (2014.01); B23K 103/10 (2006.01); B23K 26/354 (2014.01); B29L 9/00 (2006.01); B29C 65/48 (2006.01); B29C 65/52 (2006.01);
U.S. Cl.
CPC ...
B32B 7/12 (2013.01); B23B 3/30 (2013.01); B23K 26/352 (2015.10); B23K 26/355 (2018.08); B23K 26/3568 (2018.08); B29C 65/54 (2013.01); B29C 65/542 (2013.01); B29C 66/028 (2013.01); B29C 66/303 (2013.01); B29C 66/30325 (2013.01); B29C 66/721 (2013.01); B29C 66/73162 (2013.01); B29C 66/73771 (2013.01); B29C 66/742 (2013.01); B32B 15/04 (2013.01); B62D 21/11 (2013.01); B62D 29/005 (2013.01); C09J 5/02 (2013.01); B23B 3/26 (2013.01); B23K 26/0006 (2013.01); B23K 26/324 (2013.01); B23K 26/354 (2015.10); B23K 2103/10 (2018.08); B29C 65/48 (2013.01); B29C 65/52 (2013.01); B29C 66/112 (2013.01); B29C 66/43 (2013.01); B29C 66/73185 (2013.01); B29C 66/7422 (2013.01); B29L 2009/003 (2013.01); B29L 2031/30 (2013.01); B29L 2031/3002 (2013.01); B32B 15/18 (2013.01); B32B 2260/00 (2013.01); B32B 2305/00 (2013.01); B32B 2307/702 (2013.01); B32B 2307/752 (2013.01); B32B 2310/0806 (2013.01); B32B 2311/24 (2013.01); B32B 2605/00 (2013.01); B62D 27/026 (2013.01); C09J 2205/31 (2013.01); C09J 2400/166 (2013.01); Y10S 148/138 (2013.01); Y10S 148/903 (2013.01); Y10T 29/49906 (2015.01); Y10T 428/24545 (2015.01); Y10T 428/24612 (2015.01);
Abstract

An amorphous structure layer is formed on a surface layer of a bonded portion of each of side brackets. A bottomed hole layer including a plurality of bottomed holes is formed on a surface layer of the amorphous structure layer. Each of the bottomed holes has a reverse-tapered shape, which has, between an opening portion and a bottom portion of each of the bottomed holes, a bulged portion having a larger inner circumference than the opening portion. An adhesive is injected into the bottomed holes. An outer circumferential surface of the bonded portion of each of the side brackets and an inner circumferential surface of an end portion of a center beam face toward each other with the adhesive interposed therebetween.

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