The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2019
Filed:
Apr. 16, 2014
Applicant:
Hewlett-packard Development Company, L.p., Houston, TX (US);
Inventors:
Sergio Puigardeu Aramendia, Barcelona, ES;
Alejandro Manuel De Pena, Sant Cugat del Valles, ES;
Sebastia Cortes Herms, Barcelona, ES;
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B33Y 10/00 (2015.01); B29C 64/00 (2017.01); B29C 67/00 (2017.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B29C 64/165 (2017.01); B29C 64/386 (2017.01); B29C 64/40 (2017.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
B29C 67/0092 (2013.01); B29C 64/00 (2017.08); B29C 64/165 (2017.08); B29C 64/386 (2017.08); B29C 64/40 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B29K 2105/251 (2013.01);
Abstract
In one example, a non-transitory processor readable medium with instructions thereon that when executed cause an additive manufacturing machine to: form a first layer of build material; form a second layer of build material over the first layer; solidify build material in the second layer to form a slice; and form a barrier that is separable from the slice to prevent a coalescing agent in the second layer penetrating build material in the first layer.