The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2019
Filed:
Feb. 24, 2014
Applicant:
Sharp Kabushiki Kaisha, Osaka-shi, Osaka, JP;
Inventor:
Kenji Misono, Osaka, JP;
Assignee:
SHARP KABUSHIKI KAISHA, Sakai, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 53/04 (2006.01); B29C 35/02 (2006.01); B65H 45/04 (2006.01); H01L 21/683 (2006.01); B29C 53/06 (2006.01); H01L 29/786 (2006.01); H01L 27/12 (2006.01); G02F 1/1333 (2006.01); B29C 65/02 (2006.01); B29C 65/00 (2006.01); B29C 70/68 (2006.01); B32B 27/08 (2006.01); B32B 27/34 (2006.01); B32B 7/12 (2006.01); B32B 23/08 (2006.01); B32B 23/20 (2006.01); B32B 27/06 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); B29K 101/12 (2006.01); B29K 679/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 53/04 (2013.01); B29C 35/02 (2013.01); B29C 53/066 (2013.01); B29C 65/02 (2013.01); B29C 66/45 (2013.01); B29C 70/685 (2013.01); B32B 7/12 (2013.01); B32B 23/08 (2013.01); B32B 23/20 (2013.01); B32B 27/06 (2013.01); B32B 27/08 (2013.01); B32B 27/281 (2013.01); B32B 27/302 (2013.01); B32B 27/304 (2013.01); B32B 27/306 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 27/365 (2013.01); B65H 45/04 (2013.01); G02F 1/133305 (2013.01); H01L 21/6835 (2013.01); H01L 27/1218 (2013.01); H01L 29/78603 (2013.01); B29K 2101/12 (2013.01); B29K 2679/08 (2013.01); B29L 2031/3475 (2013.01); B32B 2274/00 (2013.01); B32B 2457/20 (2013.01); B32B 2457/202 (2013.01); B32B 2457/208 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68381 (2013.01);
Abstract
Prepared is a film device (FD) in which a first thermoplastic film (), a device layer () (i.e., a multi-layer product including a polyimide film and a device body), and a second thermoplastic film () are arranged. The film device (FD) is pressed against a forming mold () and heated at a lower temperature than the temperature limit of the polyimide film, such that the first thermoplastic film is stretched to conform to the shape of the forming mold ().