The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2019
Filed:
Oct. 07, 2015
Applicant:
Mitsubishi Heavy Industries Machine Tool Co., Ltd., Ritto-shi, Shiga, JP;
Inventors:
Jun Utsumi, Tokyo, JP;
Takayuki Goto, Tokyo, JP;
Takenori Suzuki, Tokyo, JP;
Kensuke Ide, Tokyo, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/447 (2006.01); H01L 21/603 (2006.01); H01L 23/498 (2006.01); B23K 20/02 (2006.01); B23K 20/00 (2006.01); H01L 21/02 (2006.01); B23K 20/22 (2006.01); B32B 37/14 (2006.01); B81C 3/00 (2006.01); H01L 21/20 (2006.01); H01L 21/18 (2006.01);
U.S. Cl.
CPC ...
B23K 20/02 (2013.01); B23K 20/00 (2013.01); B23K 20/22 (2013.01); B32B 37/14 (2013.01); B81C 3/001 (2013.01); H01L 21/02 (2013.01); H01L 21/187 (2013.01); H01L 21/2007 (2013.01); H01L 23/49827 (2013.01); H01L 23/49833 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/80895 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/15787 (2013.01);
Abstract
Provided is a semiconductor device formed by performing bonding at room temperature with respect to a wafer in which bonded electrodes and insulating layers and are respectively exposed to front surfaces, including a bonding interlayer which independently exhibits non-conductivity and exhibits conductivity by being bonded to the bonded electrodes, between the front surfaces.