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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10486231 B1

PDFFull Text
Date of Patent:
Nov. 26, 2019

Filed:

Aug. 17, 2016

Silver-coated copper powder

Applicant:

Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;

Inventors:

Hiroyuki Morinaka, Hiroshima, JP;

Kentaro Ochi, Hiroshima, JP;

Assignee:

Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;

Attorney:

Young & Thompson

Primary Examiner:

Daniel J Schleis

Int. Cl.
CPC ...
B22F 1/00 (2006.01); B22F 1/02 (2006.01); C22C 9/00 (2006.01); H01B 1/02 (2006.01); C25C 5/02 (2006.01); C25C 1/12 (2006.01);
U.S. Cl.
CPC ...
B22F 1/025 (2013.01); B22F 1/0007 (2013.01); B22F 1/0011 (2013.01); B22F 1/0088 (2013.01); C22C 9/00 (2013.01); B22F 2001/0066 (2013.01); B22F 2301/10 (2013.01); B22F 2301/255 (2013.01); B22F 2301/40 (2013.01); B22F 2303/30 (2013.01); B22F 2304/058 (2013.01); B22F 2304/10 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); C25C 1/12 (2013.01); C25C 5/02 (2013.01); H01B 1/02 (2013.01); Y10T 428/12181 (2015.01);
Abstract

A novel silver-coated copper powder, particularly a silver-coated copper powder particle having a dendritic shape, having increased electrical conductivity with no need to increase the silver content is provided. The silver-coated copper powder is composed of a silver-coated copper particle coated with a silver layer containing silver or a silver alloy, including a silver-coated copper particle having a dendritic shape, containing nitrogen (N) in the silver layer, and having a nitrogen (N) content of 0.2 to 10.0 parts by mass with respect to 100 parts by mass of the silver content.

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Morinaka, Hiroyuki. (2019). Silver-coated copper powder (U.S. Patent No. 10486231). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10486231

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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