The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2019
Filed:
Feb. 19, 2016
Matsumoto Yushi-seiyaku Co., Ltd., Yao-shi, Osaka, JP;
Satoshi Kawanami, Yao, JP;
Yoshitsugu Sasaki, Yao, JP;
MATSUMOTO YUSHI-SEIYAKU CO., LTD., Osaka, JP;
Abstract
Heat-expandable microspheres having an expansion temperature which can be decreased by a simple means without changing the polymerizable monomer and its ratio and/or changing the blowing agent and its ratio, and applications thereof. The heat-expandable microspheres are composed of a thermoplastic resin shell and a core material encapsulated therein. The core material contains a thermally-vaporizable blowing agent which imparts a swelling degree of less than 5% as defined by the following formula (I) and a component (A) which imparts a swelling degree of 5 to 30% as defined by the following formula (I), wherein an amount of the component (A) ranges from 0.0001 to 30 parts by weight to 100 parts by weight of the blowing agent:Swelling degree (%)={()/}×100  (I)wherein Mand Mare as defined herein.