The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2019
Filed:
Jun. 27, 2017
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Assignee:
Sony Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); A43B 13/14 (2006.01); A43B 13/12 (2006.01); A43B 7/24 (2006.01); A43B 13/18 (2006.01);
U.S. Cl.
CPC ...
A43B 13/14 (2013.01); A43B 7/24 (2013.01); A43B 13/12 (2013.01); A43B 13/125 (2013.01); A43B 13/141 (2013.01); A43B 13/183 (2013.01); A43B 13/185 (2013.01);
Abstract
There is provided a semiconductor device, including a semiconductor substrate, an interlayer insulating layer formed on the semiconductor substrate, a bonding electrode formed on a surface of the interlayer insulating layer, and a metal film which covers an entire surface of a bonding surface including the interlayer insulating layer and the bonding electrode.
Hagimoto, Yoshiya. (2019). Semiconductor device and electronic apparatus with metal-containing film layer at bonding surface thereof (U.S. Patent No. 10485293). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10485293
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile