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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10485139 B1

PDFFull Text
Date of Patent:
Nov. 19, 2019

Filed:

Jan. 31, 2018

Power module, thermal dissipation structure of the power module and contact method of the power module

Applicant:

Rohm Co., Ltd., Kyoto-shi, Kyoto, JP;

Inventor:

Katsuhiko Yoshihara, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:

Hamre, Schumann, Mueller & Larson, P.C.

Primary Examiner:

Mukundbhai G Patel

Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/36 (2006.01); H01L 23/40 (2006.01); H01L 23/10 (2006.01); H01L 23/495 (2006.01); H05K 7/02 (2006.01); H01L 23/31 (2006.01); H01L 29/78 (2006.01); H01L 29/739 (2006.01); H01L 29/16 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20509 (2013.01); H01L 23/10 (2013.01); H01L 23/3107 (2013.01); H01L 23/36 (2013.01); H01L 23/40 (2013.01); H01L 23/49562 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H01L 23/49586 (2013.01); H01L 29/1608 (2013.01); H01L 29/7395 (2013.01); H01L 29/7802 (2013.01); H01L 29/7813 (2013.01); H05K 7/026 (2013.01); H05K 7/209 (2013.01); H01L 29/2003 (2013.01);
Abstract

The power module in which a plurality of switching elements connected in series between a first and second power terminals and a circuit configured to connect connecting points thereof to an output terminal are formed, the power module includes: a heat sink to which the switching elements are contacted; a package configured to seal a perimeter of the plurality of switching elements and a part of each terminal so as to expose at least one portion of the heat sink; and a protruding portion for thickness control configured to regulate a thickness of a thermally-conductive material when contacting the heat sink to the cooling apparatus facing the cooling apparatus via the thermally-conductive material, wherein each terminal is exposed from opposite side surfaces of the package, the opposite side surfaces having a height different from a height of an exposed surface of the cooling apparatus of the package.

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