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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10485112 B1

PDFFull Text
Date of Patent:
Nov. 19, 2019

Filed:

Jun. 08, 2017

Ceramic circuit substrate and method for producing ceramic circuit substrate

Applicant:

Tanaka Kikinzoku Kogyo K.k., Chiyoda-ku, Tokyo, JP;

Inventor:

Takaomi Kishimoto, Tomioka, JP;

Assignee:

TANAKA KIKINZOKU KOGYO K.K., Tokyo, JP;

Attorneys:

Orrick, Herrington & Sutcliffe LLP

Joseph A. Calvaruso

K. Patrick Herman

Primary Examiner:

Tremesha S Willis

Int. Cl.
CPC ...
H05K 3/46 (2006.01); C22C 5/06 (2006.01); H01L 23/12 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H01L 23/15 (2006.01); H01L 23/36 (2006.01); H01L 23/498 (2006.01); B23K 1/00 (2006.01); B23K 35/30 (2006.01); C04B 37/02 (2006.01); H05K 1/09 (2006.01); B23K 35/00 (2006.01); B23K 35/02 (2006.01); B32B 15/01 (2006.01); C22C 5/08 (2006.01); C22C 9/00 (2006.01); H05K 3/00 (2006.01); H05K 3/38 (2006.01); B23K 103/12 (2006.01); B23K 101/42 (2006.01); B23K 35/26 (2006.01); B23K 35/28 (2006.01); B23K 35/32 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4644 (2013.01); B23K 1/0016 (2013.01); B23K 35/007 (2013.01); B23K 35/0238 (2013.01); B23K 35/3006 (2013.01); B32B 15/018 (2013.01); C04B 37/023 (2013.01); C04B 37/026 (2013.01); C22C 5/06 (2013.01); C22C 5/08 (2013.01); C22C 9/00 (2013.01); H01L 23/12 (2013.01); H01L 23/15 (2013.01); H01L 23/36 (2013.01); H01L 23/498 (2013.01); H05K 1/0203 (2013.01); H05K 1/0271 (2013.01); H05K 1/0306 (2013.01); H05K 1/09 (2013.01); B23K 35/26 (2013.01); B23K 35/286 (2013.01); B23K 35/30 (2013.01); B23K 35/32 (2013.01); B23K 35/325 (2013.01); B23K 2101/42 (2018.08); B23K 2103/12 (2018.08); C04B 2237/125 (2013.01); C04B 2237/126 (2013.01); C04B 2237/127 (2013.01); C04B 2237/343 (2013.01); C04B 2237/348 (2013.01); C04B 2237/36 (2013.01); C04B 2237/361 (2013.01); C04B 2237/363 (2013.01); C04B 2237/365 (2013.01); C04B 2237/366 (2013.01); C04B 2237/368 (2013.01); C04B 2237/407 (2013.01); C04B 2237/50 (2013.01); C04B 2237/52 (2013.01); C04B 2237/60 (2013.01); C04B 2237/708 (2013.01); C04B 2237/74 (2013.01); H05K 3/0061 (2013.01); H05K 3/388 (2013.01); H05K 2201/066 (2013.01); H05K 2203/128 (2013.01);
Abstract

A ceramic circuit substrate according to the present invention includes a ceramic substrate, a copper circuit made of a copper-based material bonded, via a bonding layer, to a surface of the ceramic, and a copper heat sink made of the copper-based material bonded, via a bonding layer, to the other surface of the ceramic. The bonding layers each include a brazing material component including two or more kinds of metals, such as Ag, and an active metal having a predetermined concentration. The bonding layers each include a brazing material layer including the brazing material component, and an active metal compound layer containing the active metal. A ratio of a bonding area of the active metal compound layer in a bonding area of each of the bonding layers is 88% or more.

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