The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2019
Filed:
Jul. 20, 2018
Applicant:
Yazaki Corporation, Minato-ku, Tokyo, JP;
Inventors:
Mizuki Shirai, Susono, JP;
Hiroki Kondo, Susono, JP;
Assignee:
Yazaki Corporation, Minato-ku, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 3/00 (2006.01); H05K 3/06 (2006.01); H05K 3/10 (2006.01); H05K 3/36 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01); H01R 4/04 (2006.01); H01R 12/52 (2011.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4038 (2013.01); H01R 4/04 (2013.01); H01R 12/52 (2013.01); H05K 1/092 (2013.01); H05K 1/115 (2013.01); H05K 3/1216 (2013.01); H05K 2201/09563 (2013.01);
Abstract
An electrical connection method of a printed circuit includes overlapping a base material and a thin member in which a thin conductor is mounted, forming a through hole which passes through the base material overlapped with the thin member in the overlapping and reaches the thin conductor of the thin member, and forming a printed circuit on the base material by a screen printing method using conductive paste. The through hole formed in the forming of the through hole is filled with the conductive paste in the forming of the printed circuit.