The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2019
Filed:
Sep. 22, 2017
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Yong Sam Lee, Suwon-si, KR;
Won Joong Kim, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 1/111 (2013.01); H05K 1/112 (2013.01); H05K 3/0038 (2013.01); H05K 3/0094 (2013.01); H05K 1/113 (2013.01); H05K 3/0055 (2013.01); H05K 3/427 (2013.01);
Abstract
A substrate including a through hole only in one of a direction from a top surface to a bottom surface of the substrate or a direction from a bottom surface to a top surface of the substrate, a protruding portion of a metal layer protruding toward the through hole being removed, and a plating layer on an inner surface of the substrate on at least the through hole.