The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Aug. 14, 2018
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jong-Min Kim, Suwon-si, KR;

Do-Hyung Kim, Hwaseong-si, KR;

Kyoung-Sun Kim, Uijeongbu-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/112 (2013.01); H05K 1/024 (2013.01); H05K 1/0245 (2013.01); H05K 1/0253 (2013.01);
Abstract

A printed circuit board (PCB) includes a first insulating layer, a pad disposed on the first insulating layer, and a first reference layer on which the first insulating layer is disposed, the first reference layer including a dielectric passage for forming a return path of a signal that is transmitted to the pad, and a conductive line disposed in the dielectric passage and disposed to form a transmission path of the signal. The PCB further includes a second insulating layer on which the first reference layer is disposed, and a second reference layer on which the second insulating layer is disposed, the second reference layer further forming the return path. A capacitance of the pad corresponds to a distance between the pad and the second reference layer.


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